FIB Lift-Out (Lamella Carrier) Grids

Overview

FIB (Focused Ion Beam) lift-out grids—also known as lamella carrier grids—are specialised specimen carriers used to support ultra-thin sections of material (lamellae) prepared for Transmission Electron Microscopy (TEM) and Scanning TEM (STEM). Unlike conventional mesh TEM grids, lift-out grids are engineered structural carriers designed specifically for the in-situ lift-out process, enabling precise transfer, secure mounting, and stable imaging of site-specific samples extracted directly from bulk materials.

These grids are critical consumables in semiconductor failure analysis, process development, and advanced materials research, where mechanical stability, analytical cleanliness, and geometric control directly influence imaging resolution and data reliability.

What Is a Lamella Lift-Out Grid?

A lamella lift-out grid is designed to:

Receive a lamella extracted from a bulk sample using a FIB system
Secure the lamella during final thinning
Maintain mechanical stability during TEM/STEM imaging and analytical techniques

Rather than acting as a passive support, lift-out grids form part of the sample preparation system and are integral to successful high-resolution microscopy workflows.

Key Design Features

Half-Moon (C-Clip) Geometry
Most FIB lift-out grids are 3 mm half-moon grids, leaving the upper portion open to allow unobstructed access by a nanomanipulator needle during sample transfer.

Advantages include:

Excellent access for in-situ lift-out
Maximum tilt freedom in the TEM
Compatibility with automated FIB and AutoTEM workflows

Post Configurations
Lift-out grids incorporate vertical posts or pins to which the lamella is welded using ion-beam-deposited platinum or tungsten.

Common post designs include:

Straight / Flagpole Posts – Simple, fast attachment; suitable for plan-view samples and EDS analysis
V-Notch Posts – Central notch supports the lamella on both sides, improving mechanical stability during thinning

Indexed Identification
Many grids feature numerical or alphabetical indexing beneath each post (e.g. A–E or 1–5), allowing multiple lamellae to be mounted and identified on a single grid.

Common Lamella Carrier Grid Designs

A. Half-Moon (C-Clip) Grids
Most widely used in semiconductor fabs

Multiple vertical posts arranged around a solid rim
Lamella welded between posts

Typical applications:

Cross-sectional transistor analysis
Contact and via failure analysis

B. Post-Style (Fence / Fork) Grids

Rows of vertical posts
Supports multiple lamellae per grid

Advantages:

High throughput

Limitations:

Reduced tilt freedom

Typical use:

Yield learning
Process monitoring

C. Slot Grids for Lamellae

Long rectangular opening
Lamella spans the slot