SEMI E177 TEM Lamella Carriers (LCs)
SEMI E177 is the first international standard specifically for TEM Lamella Carriers (LCs), published by the SEMI industry association in 2019. These are not "grids" in the traditional mesh sense, but rather high-precision specimen support structures designed for automated semiconductor failure analysis.
Purpose of SEMI E177
- Automation: The primary goal is to enable a fully automated workflow from sample preparation (typically via Focused Ion Beam/FIB) to investigation in the Transmission Electron Microscope.
- Interoperability: By standardizing the form factor and dimensions, the standard ensures that lamella carriers from different suppliers are compatible with the same robotic handling tools and microscope stages.
Key Specifications
- Design Features: Conforming carriers typically feature specific geometries such as 5 or 8 posts (to which the thin lamella is attached) and 3 fiducial marks for automated machine vision and alignment.
- Physical Parameters: The standard covers geometrical dimensions, material requirements, and identification marks (IDs) necessary for transport and storage between tools.
- Silicon Integration: Many SEMI E177 carriers utilize silicon substrates and can be combined with silicon nitride membranes to create robust, carbon-free support for high-resolution imaging in semiconductor manufacturing.
Applications in Semiconductor Workflows
- Lamella Preparation: A "lamella" (a microscopic slice of a wafer) is cut using a FIB.
- Attachment: The lamella is mechanically supported by being welded to one of the posts on the SEMI E177 carrier.
- Analysis: The carrier is then automatically moved to a TEM for process control, defect analysis, or technology development.